When you think of optimal cooling, think of an optima Kierland

Posted November 10, 2018 09:16:17When you think about optimal cooling.

You might think of it in the context of cooling a radiator, or in a car’s air-conditioning system.

But what about when it comes to cooling a CPU or GPU?

Optimas thermal management system is the first time the company has designed a CPU cooler to be cooled by the GPU itself, with a unique solution for each GPU and each CPU.

The cooling solution works in the same way as a traditional CPU cooler.

It relies on a small, powerful GPU and a low-profile CPU cooler, and the resulting heat transfer occurs at the GPU’s core.

The result is that the cooler’s thermal efficiency is maximized and its temperature stays below the CPU’s target, even when the CPU is idle.

Optima’s cooling solution, in addition to using a low profile GPU cooler, also relies on its internal GPU core to be kept cooler.

The company’s technology also helps ensure that the GPU stays cool, because there is no heat passing through the heatsink, reducing the chances of it overheating.

It’s a new way of cooling CPUs, and one that has been around for some time.

Intel’s LGA775 processors and other chips have a CPU core cooler in the form of a copper tube.

The LGA1151 CPU core uses this tube to cool its thermal interface and its fans, while the Xeon Phi CPU core used on the Broadwell-EP Xeon E5-2670K processor uses this same tube.

In Optima’s case, the GPU cooler has been designed with the same cooling mechanism as the CPU cooler’s fan.

That means that the heat transfer from the GPU is also kept within the thermal interface.

The Thermal Design Power (TDP) is a metric that measures the heat that is transferred between a thermal interface (in this case, a copper sleeve) and a cooling device (usually a CPU fan).

For CPUs, the TDP is typically measured in watts, while for GPUs it’s usually measured in gigawatts.

Optima’s cooling system for Intel’s Xeon Phi CPUs is built around a copper ring, and is comprised of two separate copper rings, one of which is the GPU core’s thermal interface ring.

Each ring has two holes that are separated by a copper pad.

Each hole has a slot that has two heat pipes, one for each fan, with the heat pipes separated by two slots.

Each fan is connected to the thermal interfaces through two copper heat pipes.

The thermal interface layer has two slots that connect it to the fans.

The heat pipes are separated and connected to two copper pads.

The copper pad is connected directly to the CPU core, and sits on top of the copper ring.

Optimal cooling for the GPU also relies heavily on Optima technology.

The entire cooling system, including the heat pump, heatsink and fan, is made of high-quality materials, and uses a heat pipe that’s about as tall as the GPU.

The two heat-pipes are connected to a large copper ring with holes that run between the two copper rings.

The ring itself is about 1.5 inches (50 centimeters) in diameter.

The thermal design power (Tdp) for the Optima cooler is about 30 watts per inch (0.07 watts per cm2).

The thermal design is achieved by using a large, solid copper ring that has a thermal pad that’s approximately the size of the CPU and fan heat pipes combined.

The pad is sandwiched between the heat pipe and thermal interface, and that thermal pad is cooled by a small fan that’s mounted directly to one of the heat pads.

Optimo’s cooling strategy for Intel Xeon Phi processors is slightly different.

The heatsink has a copper-to-silicon (Si-Si) contact, with copper plates that connect the two Si-Si contact.

Each heat pipe has two copper plates connected to it through the contact.

The contact is covered by a heat-recovery layer that’s similar to that of the Intel Xeon E5320 processor.

The contacts are spaced about 1 millimeter apart.

The heat pipes have two slots for each heat pipe, with one slot for each heatsink.

The slots are connected directly between the heatsinks and the heat-flow ports.

The slot for the heatsinking contacts the heatspipes directly to their thermal interface layers, while that slot for fan contact connects the heatspreaders directly to thermal pads.

In all, the cooling system is roughly 1.8 feet (50.6 centimeters) long, 3 feet (1.3 meters) wide and 2 feet (0,9 meters) deep.

The temperature is achieved with a typical GPU fan running at 10 percent speed.

The Optima cooling solution is designed to work with Intel Xeon processors that use Intel Xeon P7 and P7+ CPU architectures